Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569127 | Double patterning approach by direct metal etch | Hsi-Wen Tien, Wei-Hao Liao, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2023-01-31 |
| 11521896 | Selective deposition of a protective layer to reduce interconnect structure critical dimensions | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Wei-Hao Liao | 2022-12-06 |
| 11488926 | Self-aligned interconnect structure | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao | 2022-11-01 |
| 11482447 | Method of forming an integrated chip having a cavity between metal features | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Shau-Lin Shue +1 more | 2022-10-25 |
| 11362030 | Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability | Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Hsi-Wen Tien, Wei-Hao Liao | 2022-06-14 |
| 11302641 | Self-aligned cavity strucutre | Wei-Hao Liao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien | 2022-04-12 |