Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414479 | Sub 60nm etchless MRAM devices by ion beam etching fabricated T-shaped bottom electrode | Dongna Shen, Yu-Jen Wang | 2025-09-09 |
| 12349717 | Automatic separator for peel and pulp of holboellia latifolia wall | Wei Wang, Yao Lu, Shuxian Song, Qinglin Wang, Beibei Jia | 2025-07-08 |
| 12310245 | Etching and encapsulation scheme for magnetic tunnel junction fabrication | Vignesh Sundar, Dongna Shen, Zhongjian Teng, Jesmin Haq, Sahil Patel +2 more | 2025-05-20 |
| 12245516 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive re-deposition | Dongna Shen, Vignesh Sundar, Yu-Jen Wang | 2025-03-04 |
| 12207567 | Under-cut via electrode for sub 60nm etchless MRAM devices by decoupling the via etch process | Dongna Shen, Yu-Jen Wang | 2025-01-21 |
| 12185638 | Metal/dielectric/metal hybrid hard mask to define ultra-large height top electrode for sub 60nm MRAM devices | Yu-Jen Wang | 2024-12-31 |
| 12108679 | Multiply spin-coated ultra-thick hybrid hard mask for sub 60nm MRAM devices | Yu-Jen Wang | 2024-10-01 |
| 11985905 | Highly physical ion resistive spacer to define chemical damage free sub 60nm MRAM devices | Dongna Shen, Yu-Jen Wang | 2024-05-14 |
| 11963457 | MTJ device performance by controlling device shape | Jesmin Haq, Tom Zhong, Zhongjian Teng, Vinh Lam | 2024-04-16 |
| 11930715 | Highly physical etch resistive photoresist mask to define large height sub 30nm via and metal hard mask for MRAM devices | Dongna Shen, Yu-Jen Wang | 2024-03-12 |
| 11856864 | Sub 60nm etchless MRAM devices by ion beam etching fabricated T-shaped bottom electrode | Dongna Shen, Yu-Jen Wang | 2023-12-26 |
| 11818961 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive re-deposition | Dongna Shen, Vignesh Sundar, Yu-Jen Wang | 2023-11-14 |
| 11800811 | MTJ CD variation by HM trimming | Dongna Shen, Jesmin Haq, Yu-Jen Wang | 2023-10-24 |
| 11785863 | Under-cut via electrode for sub 60nm etchless MRAM devices by decoupling the via etch process | Dongna Shen, Yu-Jen Wang | 2023-10-10 |
| 11723281 | Metal/dielectric/metal hybrid hard mask to define ultra-large height top electrode for sub 60nm MRAM devices | Yu-Jen Wang | 2023-08-08 |
| 11631802 | Etching and encapsulation scheme for magnetic tunnel junction fabrication | Vignesh Sundar, Dongna Shen, Zhongjian Teng, Jesmin Haq, Sahil Patel +2 more | 2023-04-18 |
| 11563171 | Highly physical ion resistive spacer to define chemical damage free sub 60 nm MRAM devices | Dongna Shen, Yu-Jen Wang | 2023-01-24 |
| 11545622 | CMP stop layer and sacrifice layer for high yield small size MRAM devices | Zhongjian Teng, Yu-Jen Wang | 2023-01-03 |
| 11527711 | MTJ device performance by controlling device shape | Jesmin Haq, Tom Zhong, Zhongjian Teng, Vinh Lam | 2022-12-13 |
| 11444241 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive R-deposition | Dongna Shen, Vignesh Sundar, Yu-Jen Wang | 2022-09-13 |
| 11430947 | Sub 60nm etchless MRAM devices by ion beam etching fabricated t-shaped bottom electrode | Dongna Shen, Yu-Jen Wang | 2022-08-30 |
| 11375782 | Outdoor umbrella frame having telescopic structure | Tongguo Wang, Jianqiang Xie | 2022-07-05 |
| 11344192 | Lighting device and endoscope having the same | Xiaodong Duan, Xu Wang, Qinghu YOU | 2022-05-31 |
| 11339994 | Control method and control device for variable-frequency and variable-capacity heat pump hot-air drying system | Yujun Wang, Yunyun Wu, Xiaowang Wu, Zhonghai Ji, Ying Wang +1 more | 2022-05-24 |
| 11329218 | Multiply spin-coated ultra-thick hybrid hard mask for sub 60nm MRAM devices | Yu-Jen Wang | 2022-05-10 |