Issued Patents All Time
Showing 126–150 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406797 | Semiconductor integrated circuit with dislocations | Chun-Chieh Wang, Shih-Chieh Chang, Ying-Min Chou | 2016-08-02 |
| 9397129 | Dielectric film for image sensor | Volume Chien, Che-Min Lin, Chi-Cherng Jeng, Chih-Mu Huang | 2016-07-19 |
| 9379275 | Apparatus and method for reducing dark current in image sensors | Miao-Cheng Liao, Jinn-Kwei Liang, Wen-Chieh Hsieh, Hsiang Hsiang Ko, Ying-Lang Wang | 2016-06-28 |
| 9368540 | CIS image sensors with epitaxy layers and methods for forming the same | Min Hao Hong, Kei-Wei Chen, Chi-Cherng Jeng | 2016-06-14 |
| 9356059 | BSI image sensor chips and methods for forming the same | Kei-Wei Chen, Ying-Lang Wang | 2016-05-31 |
| 9349902 | System and method for reducing irregularities on the surface of a backside illuminated photodiode | Kei-Wei Chen, Chi-Cherng Jeng, Min Hao Hong | 2016-05-24 |
| 9337303 | Metal gate stack having TiAICN as work function layer and/or blocking/wetting layer | Chi-Wen Liu, Chi-Cherng Jeng, Ting-Chun Wang | 2016-05-10 |
| 9337192 | Metal gate stack having TaAlCN layer | Ting-Chun Wang, Chi-Cherng Jeng, Chi-Wen Liu | 2016-05-10 |
| 9257476 | Grids in backside illumination image sensor chips and methods for forming the same | Min Hao Hong, Ting-Chun Wang, Chung-Ren Sun | 2016-02-09 |
| 9219092 | Grids in backside illumination image sensor chips and methods for forming the same | Szu-An Wu, Sheng-Wen Chen | 2015-12-22 |
| 9214514 | Mechanisms for forming semiconductor device having stable dislocation profile | Min Hao Hong, Chih-Tsung Lee, Miao-Cheng Liao | 2015-12-15 |
| 9123608 | Backside illuminated CMOS image sensor | Volume Chien, Szu-An Wu | 2015-09-01 |
| 9112090 | UV radiation recovery of image sensor | Chung-Ren Sun, Chun-Jung Chang, Tong-Her Sher | 2015-08-18 |
| 9041140 | Grids in backside illumination image sensor chips and methods for forming the same | Min Hao Hong, Ting-Chun Wang, Chung-Ren Sun | 2015-05-26 |
| 9024369 | Metal shield structure and methods for BSI image sensors | Chi-Cherng Jeng, Volume Chien, Ying-Lang Wang | 2015-05-05 |
| 9006070 | Two-step shallow trench isolation (STI) process | Min Hao Hong, You-Hua Chou, Chih-Tsung Lee, Miao-Cheng Liao, Hsiang Hsiang Ko +1 more | 2015-04-14 |
| 8946083 | In-situ formation of silicon and tantalum containing barrier | Ting-Chun Wang, Szu-An Wu | 2015-02-03 |
| 8907385 | Surface treatment for BSI image sensors | Chin-Nan Wu, Chun Che Lin | 2014-12-09 |
| 8889461 | CIS image sensors with epitaxy layers and methods for forming the same | Min Hao Hong, Kei-Wei Chen, Chih-Cherng Jeng | 2014-11-18 |
| 8890273 | Methods and apparatus for an improved reflectivity optical grid for image sensors | Kei-Wei Chen, Ying-Lang Wang | 2014-11-18 |
| 8847286 | Image sensor and method of manufacturing | Kei-Wei Chen, Szu-An Wu, Ying-Lang Wang | 2014-09-30 |
| 8815630 | Back side illumination (BSI) sensors, manufacturing methods thereof, and semiconductor device manufacturing methods | Chin-Nan Wu, Chun Che Lin, Yu-Ku Lin | 2014-08-26 |
| 8772899 | Method and apparatus for backside illumination sensor | Min Hao Hong, Kei-Wei Chen, Ying-Lang Wang | 2014-07-08 |
| 8759952 | Oxygen-rich layers underlying BPSG | Wan-Ting Huang, Yu-Jen Chien, Phil Sun | 2014-06-24 |
| 8748885 | Soft material wafer bonding and method of bonding | Tung-Ti Yeh, Chung-Yi Huang, Ya-Wen Wu, Hui Mei Jao, Ting-Chun Wang +1 more | 2014-06-10 |