Issued Patents All Time
Showing 76–98 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9341671 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Ching-Nen Peng, Hao Chen | 2016-05-17 |
| 9310437 | Adaptive test sequence for testing integrated circuits | Chun-Cheng Chen, Mill-Jer Wang, Hao Chen, Ching-Nen Peng | 2016-04-12 |
| 9252593 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2016-02-02 |
| 9234940 | Integrated fan-out wafer architecture and test method | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2016-01-12 |
| 9129973 | Circuit probing structures and methods for probing the same | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2015-09-08 |
| 9086452 | Three-dimensional integrated circuit and method for wireless information access thereof | Mill-Jer Wang, Chewn-Pu Jou, Ching-Nen Peng, Huan-Neng Chen, Kuang-Kai Yen +4 more | 2015-07-21 |
| 8956889 | Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC) | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2015-02-17 |
| 8957691 | Probe cards for probing integrated circuits | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2015-02-17 |
| 8952711 | Methods for probing semiconductor wafers | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2015-02-10 |
| 8922230 | 3D IC testing apparatus | Mill-Jer Wang, Chih-Chia Chen, Ching-Nen Peng, Hao Chen | 2014-12-30 |
| 8866488 | Power compensation in 3DIC testing | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2014-10-21 |
| 8836355 | Dynamic testing based on thermal and stress conditions | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2014-09-16 |
| 8614105 | Production flow and reusable testing method | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2013-12-24 |
| 8573811 | Backlight module with heat dissipating element and heat sink | Yi-Wen Lin | 2013-11-05 |
| 8573794 | Backlight module | Yi-Wen Lin | 2013-11-05 |
| 8421073 | Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC) | Mill-Jer Wang, Ching-Nen Peng, Hao Chen | 2013-04-16 |
| 8410709 | Parallel light-emitting circuit of parallel LED light-emitting device and circuit board thereof | — | 2013-04-02 |
| 8324837 | Parallel light-emitting circuit of parallel LED light-emitting device and circuit board thereof | — | 2012-12-04 |
| 8297827 | Backlight module | Ming-Feng Huang, Yi-Wen Lin | 2012-10-30 |
| 8294844 | Liquid crystal display and assembly method of the same | Li-Yi Chen, Cheng-Jung Chen, Yu-Ming Lin, Yi WANG | 2012-10-23 |
| 7840194 | Transmitting circuit, receiving circuit, interface switching module and interface switching method for SATA and SAS interfaces | Yu-Hsin Wu, Min-Chung Chou | 2010-11-23 |
| 7394212 | Inverter and inverter unit thereof | Chin-Der Wey, Tsung-Shiun Lee, Wei-Chung Chuang | 2008-07-01 |
| 7217005 | Light emitting diode lamp module | — | 2007-05-15 |