Issued Patents All Time
Showing 126–142 of 142 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6130167 | Method of preventing corrosion of a metal structure exposed in a non-fully landed via | Shu Yang, Chao-Cheng Chen | 2000-10-10 |
| 6043163 | HCL in overetch with hard mask to improve metal line etching profile | Chia-Shiung Tsai, Chao-Cheng Chen | 2000-03-28 |
| 6040248 | Chemistry for etching organic low-k materials | Chao-Cheng Chen, Ming-Hsin Huang, Chia-Shiung Tsai | 2000-03-21 |
| 6037266 | Method for patterning a polysilicon gate with a thin gate oxide in a polysilicon etcher | Chia-Shiung Tsai | 2000-03-14 |
| 6025273 | Method for etching reliable small contact holes with improved profiles for semiconductor integrated circuits using a carbon doped hard mask | Chao-Cheng Chen, Chia-Shiung Tsai | 2000-02-15 |
| 6015735 | Method for forming a multi-anchor DRAM capacitor and capacitor formed | Shau-Lin Shue, Chia-Shiung Tsai, Jenn Ming Huang | 2000-01-18 |
| 6015757 | Method of oxide etching with high selectivity to silicon nitride by using polysilicon layer | Chia-Shiung Tsai, Kuei-Ying Lee | 2000-01-18 |
| 5981398 | Hard mask method for forming chlorine containing plasma etched layer | Chia-Shiung Tsai, Chao-Cheng Chen | 1999-11-09 |
| 5930644 | Method of forming a shallow trench isolation using oxide slope etching | Chia-Shiung Tsai, Kuei-Ying Lee | 1999-07-27 |
| 5925575 | Dry etching endpoint procedure to protect against photolithographic misalignments | Chia-Shiung Tsai | 1999-07-20 |
| 5904566 | Reactive ion etch method for forming vias through nitrogenated silicon oxide layers | Chia-Shiung Tsai | 1999-05-18 |
| 5899748 | Method for anchoring via/contact in semiconductor devices and devices formed | Chia-Shiung Tsai | 1999-05-04 |
| 5880005 | Method for forming a tapered profile insulator shape | Chia-Shiung Tsai | 1999-03-09 |
| 5871658 | Optical emisson spectroscopy (OES) method for monitoring and controlling plasma etch process when forming patterned layers | Chia-Shiung Tsai, Chen-Hua Yu | 1999-02-16 |
| 5837599 | Wafer surface modification for improved electrostatic chucking efficiency | Chia-Shiung Tsai | 1998-11-17 |
| 5694207 | Etch rate monitoring by optical emission spectroscopy | Shu-Chi Hung | 1997-12-02 |
| 5348841 | Organic dye-in-polymer (DIP) medium for write-once-read-many (WORM) optical discs | Hwa-Fu Chen | 1994-09-20 |