CK

Chung-Ting Ko

TSMC: 63 patents #490 of 12,232Top 5%
NU National Taiwan University: 1 patents #729 of 2,195Top 35%
Overall (All Time): #34,220 of 4,157,543Top 1%
64
Patents All Time

Issued Patents All Time

Showing 51–64 of 64 patents

Patent #TitleCo-InventorsDate
10804271 Semiconductor structure and device each having differential etch stop layer over gate spacer Jr-Hung Li, Chi On Chui 2020-10-13
10763104 Method of forming differential etch stop layer using directional plasma to activate surface on device structure Jr-Hung Li, Chi On Chui 2020-09-01
10720526 Stress modulation for dielectric layers Han-Chi Lin, Chunyao Wang, Ching-Yu Huang, Tze-Liang Lee, Yung-Chih Wang 2020-07-21
10629693 Semiconductor structure with barrier layer and method for forming the same Shih-Wen Huang, Hong-Hsien Ke, Chia-Hui Lin, Tai-Chun Huang 2020-04-21
10519545 Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate Kun-Mo Lin, Yi-Hung Lin, Jr-Hung Li, Tze-Liang Lee, Ting-Gang Chen 2019-12-31
10510867 FinFETs and methods of forming the same Bor Chiuan Hsieh, Ting-Gang Chen, Chien-Chung Huang, Tai-Chun Huang, Tze-Liang Lee 2019-12-17
10510612 Low-K gate spacer and formation thereof Bo-Cyuan Lu, Chunyao Wang, Jr-Hung Li, Chi On Chui 2019-12-17
10505021 FinFet device and method of forming the same Bo-Cyuan Lu, Jr-Hung Li, Chi On Chui 2019-12-10
10483168 Low-k gate spacer and formation thereof Bo-Cyuan Lu, Chunyao Wang, Jr-Hung Li, Chi On Chui 2019-11-19
10468529 Structure and formation method of semiconductor device structure with etch stop layer Bo-Cyuan Lu, Jr-Hung Li, Chi On Chui 2019-11-05
10177038 Prevention of contact bottom void in semiconductor fabrication Yun Lee, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang 2019-01-08
10157997 FinFETs and methods of forming the same Bor Chiuan Hsieh, Ting-Gang Chen, Chien-Chung Huang, Tai-Chun Huang, Tze-Liang Lee 2018-12-18
9852947 Forming sidewall spacers using isotropic etch Kuang-Yuan Hsu 2017-12-26
8410664 Method for changing ultrasound wave frequency by using the acoustic matching layer Tzong-Lin Jay Shieh, Wen-Shiang Chen, Chuin-Shan Chen 2013-04-02