Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062578 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2024-08-13 |
| 11495494 | Methods for reducing contact depth variation in semiconductor fabrication | Chen-Ming Lee, Fu-Kai Yang, Yi-Jyun Huang, Sheng-Hsiung Wang, Mei-Yun Wang | 2022-11-08 |
| 11362003 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2022-06-14 |
| 11062945 | Methods for reducing contact depth variation in semiconductor fabrication | Chen-Ming Lee, Fu-Kai Yang, Yi-Jyun Huang, Sheng-Hsiung Wang, Mei-Yun Wang | 2021-07-13 |
| 10825737 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2020-11-03 |
| 10685880 | Methods for reducing contact depth variation in semiconductor fabrication | Chen-Ming Lee, Fu-Kai Yang, Yi-Jyun Huang, Sheng-Hsiung Wang, Mei-Yun Wang | 2020-06-16 |
| 10177038 | Prevention of contact bottom void in semiconductor fabrication | Chung-Ting Ko, Chen-Ming Lee, Mei-Yun Wang, Fu-Kai Yang | 2019-01-08 |