Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8658483 | Method of fabricating an integrated circuit device having backside bevel protection | Jung-Tzu Hsu, Yu-Hsien Lin, Jyh-Huei Chen | 2014-02-25 |
| 8338242 | Backside bevel protection | Jung-Tzu Hsu, Yu-Hsien Lin, Jyh-Huei Chen | 2012-12-25 |
| 7732299 | Process for wafer bonding | Fa-Yuan Chang, Tsung-Mu Lai, Kai-Chih Liang, Hua-Shu Wu, Chin-Hsiang Ho +6 more | 2010-06-08 |