Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761468 | Device and method for wafer taping | Yuh-Sen Chang, Shang-Hsien Lin, Szu-Hsien Lee, Chia-Haw Yeh | 2017-09-12 |
| 7459386 | Method for forming solder bumps of increased height | Li-Hsin Tseng, Gil Huang, Huei-Mei Yu, Chia-Jen Cheng, Ken Sun +4 more | 2008-12-02 |