Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9613816 | Advanced process control method for controlling width of spacer and dummy sidewall in semiconductor device | Hsien-Chieh Tsai, Tz-Wei Lin, Sheng-Jen Yang, Hung-Yin Lin, Chen-Hsiang Lu | 2017-04-04 |
| 9559190 | Semiconductor structure and manufacturing method thereof | Chien-Hung Chen, Shen-Chieh Liu, Hobin Chen, WEN-LANG WU | 2017-01-31 |
| 9412606 | Target dimension uniformity for semiconductor wafers | Han-Wen Liao, Chih-Yu Lin | 2016-08-09 |
| 9384949 | Gas-flow control method for plasma apparatus | Zi-Neng Huang, Chang-Sheng Lee, Shen-Chieh Liu | 2016-07-05 |
| 9362185 | Uniformity in wafer patterning using feedback control | Chung-Hsi Wu, Han-Wen Liao, Chih-Yu Lin | 2016-06-07 |
| 9324578 | Hard mask reshaping | Han-Wen Liao, Chih-Yu Lin | 2016-04-26 |
| 9177875 | Advanced process control method for controlling width of spacer and dummy sidewall in semiconductor device | Hsien-Chieh Tsai, Tz-Wei Lin, Sheng-Jen Yang, Hung-Yin Lin, Chen-Hsiang Lu | 2015-11-03 |
| 9147767 | Semiconductor structure and manufacturing method thereof | Chien-Hung Chen, Shen-Chieh Liu, Hobin Chen, WEN-LANG WU | 2015-09-29 |
| 9087793 | Method for etching target layer of semiconductor device in etching apparatus | Han-Wen Liao, Wei-Tai Lin, Wen-Sheng Wang, Chih-Yu Lin, Chen-Hsiang Lu | 2015-07-21 |
| 9064741 | Uniformity in wafer patterning using feedback control | Chung-Hsi Wu, Han-Wen Liao, Chih-Yu Lin | 2015-06-23 |
| 6423175 | Apparatus and method for reducing particle contamination in an etcher | Yu-Chih Huang, I Chang Wu | 2002-07-23 |
| 6117349 | Composite shadow ring equipped with a sacrificial inner ring | Yu-Chih Huang, Shuan Yu Chang | 2000-09-12 |