Issued Patents All Time
Showing 226–249 of 249 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6764965 | Method for improving the coating capability of low-k dielectric layer | Tsung-Tang Hsieh, Chih-An Huang | 2004-07-20 |
| 6677231 | Method for increasing adhesion ability of dielectric material in semiconductor | Chin-Hsiang Lin, Ming-Sheng Yang | 2004-01-13 |
| 6670715 | Bilayer silicon carbide based barrier | Neng-Hui Yang, Hsin-Chang Wu | 2003-12-30 |
| 6653204 | Method of forming a shallow trench isolation structure | Hsin-Chang Wu, Neng-Hui Yang, Wen-Hsun Lin | 2003-11-25 |
| 6599826 | Method for fabricating a low dielectric constant material layer | Tsung-Tang Hsieh | 2003-07-29 |
| 6554002 | Method for removing etching residues | Chih-Ning Wu, Chan-Lon Yang | 2003-04-29 |
| 6521545 | Method of a surface treatment on a fluorinated silicate glass film | Neng-Hui Yang, Chinh-Fu Lin, Yi-Fang Cheng | 2003-02-18 |
| 6521300 | Method of a surface treatment in improving adhesion of an organic polymeric low-k dielectric layer | Tsung-Tang Hsieh, Hsin-Chang Wu, Chih-An Huang | 2003-02-18 |
| 6486079 | Method for stabilizing low dielectric constant materials | Yung-Tsung Wei, Teng-Chun Tsai, Ming-Sheng Yang | 2002-11-26 |
| 6429115 | Method of manufacturing multilevel interconnects including performing a surface treatment to form a hydrophilic surface layer | Chin-Hsiang Lin, Ming-Sheng Yang | 2002-08-06 |
| 6410106 | Method of forming an intermetal dielectric layer | Chih-Chien Liu, Ming-Sheng Yang | 2002-06-25 |
| 6410446 | Method for gap filling | Chih-Chien Liu, Ming-Sheng Yang | 2002-06-25 |
| 6383913 | Method for improving surface wettability of low k material | Ming-Sheng Yang | 2002-05-07 |
| 6376394 | Method of forming inter-metal dielectric layer | Chih-Chien Liu, Ming-Sheng Yang | 2002-04-23 |
| 6365228 | Process for spin-on coating with an organic material having a low dielectric constant | Ming-Sheng Yang, Chin-Hsiang Lin | 2002-04-02 |
| 6323123 | Low-K dual damascene integration process | Chih-Chien Liu, Anseime Chen, Ming-Sheng Yang | 2001-11-27 |
| 6319814 | Method of fabricating dual damascene | Chih-Chien Liu, Juan-Yuan Wu | 2001-11-20 |
| 6261977 | Method for preventing an electrostatic chuck from being corroded during a cleaning process | Chih-Chien Liu, Juan-Yuan Wu | 2001-07-17 |
| 6218284 | Method for forming an inter-metal dielectric layer | Chih-Chien Liu, Wen-Yi Hsieh, Water Lur | 2001-04-17 |
| 6200653 | Method of forming an intermetal dielectric layer | Chih-Chien Liu, Ming-Sheng Yang | 2001-03-13 |
| 6197681 | Forming copper interconnects in dielectric materials with low constant dielectrics | Chih-Chien Liu, Ming-Sheng Yang | 2001-03-06 |
| 6174793 | Method for enhancing adhesion between copper and silicon nitride | Chih-Chien Liu, Juan-Yuan Wu | 2001-01-16 |
| 6146974 | Method of fabricating shallow trench isolation (STI) | Chih-Chien Liu, Gwo-Shii Yang, Juan-Yuan Wu | 2000-11-14 |
| 6001746 | Method of forming an undoped silicate glass layer on a semiconductor wafer | Chih-Chien Liu, Wen-Yi Hsieh, Water Lur | 1999-12-14 |