Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11651983 | Apparatus, system, and method for handling aligned wafer pairs | Gregory George | 2023-05-16 |
| 11183401 | System and related techniques for handling aligned substrate pairs | Gregory George, Aaron G. Loomis | 2021-11-23 |
| 10825705 | Apparatus, system, and method for handling aligned wafer pairs | Gregory George | 2020-11-03 |
| 10580678 | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing | Gregory George, Michael B. Brennen | 2020-03-03 |
| 10319615 | Semiconductor bonding apparatus and related techniques | Gregory George | 2019-06-11 |
| 9875917 | Semiconductor bonding apparatus and related techniques | Gregory George | 2018-01-23 |
| 9859141 | Apparatus and method for aligning and centering wafers | Gregory George, Michael B. Brennen | 2018-01-02 |
| 9837295 | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing | Gregory George, Michael B. Brennen | 2017-12-05 |
| 9640418 | Apparatus, system, and method for handling aligned wafer pairs | Gregory George | 2017-05-02 |
| 9281229 | Method for thermal-slide debonding of temporary bonded semiconductor wafers | Gregory George, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles | 2016-03-08 |
| 8919412 | Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers | Gregory George, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles | 2014-12-30 |
| 8764026 | Device for centering wafers | Gregory George, Dennis Patricio | 2014-07-01 |
| 8267143 | Apparatus for mechanically debonding temporary bonded semiconductor wafers | Gregory George, Patrick Gorun, James Hermanowski, Matthew Stiles | 2012-09-18 |
| 8181688 | Apparatus for temporary wafer bonding and debonding | Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kühnle | 2012-05-22 |
| 8088684 | Apparatus and method for semiconductor wafer bumping via injection molded solder | G. Gerard Gormley | 2012-01-03 |
| 7790596 | Apparatus and method for semiconductor wafer bumping via injection molded solder | Wilhelm R. Lapointe | 2010-09-07 |
| 7732320 | Apparatus and method for semiconductor wafer bumping via injection molded solder | G. Gerard Gormley, Emmett Hughlett | 2010-06-08 |
| 6829988 | Nanoimprinting apparatus and method | Gregory George, David T. Meyer | 2004-12-14 |