Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281229 | Method for thermal-slide debonding of temporary bonded semiconductor wafers | Gregory George, Hale Johnson, Emmett Hughlett, James Hermanowski, Matthew Stiles | 2016-03-08 |
| 8919412 | Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers | Gregory George, Hale Johnson, Emmett Hughlett, James Hermanowski, Matthew Stiles | 2014-12-30 |
| 8267143 | Apparatus for mechanically debonding temporary bonded semiconductor wafers | Gregory George, Hale Johnson, James Hermanowski, Matthew Stiles | 2012-09-18 |
| 8181688 | Apparatus for temporary wafer bonding and debonding | Hale Johnson, Emmett Hughlett, James Hermanowski, Matthew Stiles, Michael Kühnle | 2012-05-22 |
| 7703658 | Apparatus and method for semiconductor wafer bumping via injection molded solder | G. Gerard Gormley, Michael J. Davidson | 2010-04-27 |