Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9281229 | Method for thermal-slide debonding of temporary bonded semiconductor wafers | Gregory George, Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles | 2016-03-08 |
| 8919412 | Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers | Gregory George, Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles | 2014-12-30 |
| 8181688 | Apparatus for temporary wafer bonding and debonding | Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles, Michael Kühnle | 2012-05-22 |
| 7732320 | Apparatus and method for semiconductor wafer bumping via injection molded solder | Hale Johnson, G. Gerard Gormley | 2010-06-08 |