Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11651983 | Apparatus, system, and method for handling aligned wafer pairs | Hale Johnson | 2023-05-16 |
| 11183401 | System and related techniques for handling aligned substrate pairs | Hale Johnson, Aaron G. Loomis | 2021-11-23 |
| 10825701 | Baking device for a wafer coated with a coating containing a solvent | Aaron Foley, Oliver Treichel | 2020-11-03 |
| 10825705 | Apparatus, system, and method for handling aligned wafer pairs | Hale Johnson | 2020-11-03 |
| 10580678 | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing | Hale Johnson, Michael B. Brennen | 2020-03-03 |
| 10319615 | Semiconductor bonding apparatus and related techniques | Hale Johnson | 2019-06-11 |
| 9916350 | Automated creation of join graphs for unrelated data sets among relational databases | Jonathan H. Young, John O'Neil, William K. Johnson, III, Martin Anthony Serrano, Udayan Das | 2018-03-13 |
| 9875917 | Semiconductor bonding apparatus and related techniques | Hale Johnson | 2018-01-23 |
| 9859141 | Apparatus and method for aligning and centering wafers | Hale Johnson, Michael B. Brennen | 2018-01-02 |
| 9837295 | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing | Hale Johnson, Michael B. Brennen | 2017-12-05 |
| 9640418 | Apparatus, system, and method for handling aligned wafer pairs | Hale Johnson | 2017-05-02 |
| 9583374 | Debonding temporarily bonded semiconductor wafers | Christopher Rosenthal | 2017-02-28 |
| 9507824 | Automated creation of join graphs for unrelated data sets among relational databases | Jonathan H. Young, John O'Neil, William K. Johnson, III, Martin Anthony Serrano, Udayan Das | 2016-11-29 |
| 9472437 | Debonding temporarily bonded semiconductor wafers | Christopher Rosenthal | 2016-10-18 |
| 9281229 | Method for thermal-slide debonding of temporary bonded semiconductor wafers | Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles | 2016-03-08 |
| 9159595 | Thin wafer carrier | Daniel T. Hurley | 2015-10-13 |
| 9064686 | Method and apparatus for temporary bonding of ultra thin wafers | Stefan Lutter | 2015-06-23 |
| 8950459 | Debonding temporarily bonded semiconductor wafers | Christopher Rosenthal | 2015-02-10 |
| 8919412 | Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers | Hale Johnson, Patrick Gorun, Emmett Hughlett, James Hermanowski, Matthew Stiles | 2014-12-30 |
| 8764026 | Device for centering wafers | Hale Johnson, Dennis Patricio | 2014-07-01 |
| 8574398 | Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers | — | 2013-11-05 |
| 8551291 | Debonding equipment and methods for debonding temporary bonded wafers | — | 2013-10-08 |
| 8425715 | Apparatus for high throughput wafer bonding | — | 2013-04-23 |
| 8366873 | Debonding equipment and methods for debonding temporary bonded wafers | — | 2013-02-05 |
| 8267143 | Apparatus for mechanically debonding temporary bonded semiconductor wafers | Hale Johnson, Patrick Gorun, James Hermanowski, Matthew Stiles | 2012-09-18 |