WL

Wilhelm R. Lapointe

SM Suss Microtec: 1 patents #3 of 16Top 20%
📍 South Burlington, VT: #758 of 1,136 inventorsTop 70%
🗺 Vermont: #3,027 of 4,968 inventorsTop 65%
Overall (All Time): #3,301,756 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7790596 Apparatus and method for semiconductor wafer bumping via injection molded solder Hale Johnson 2010-09-07