WL

Wilhelm R. Lapointe

SM Suss Microtec: 1 patents #3 of 16Top 20%
Overall (All Time): #3,301,756 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7790596 Apparatus and method for semiconductor wafer bumping via injection molded solder Hale Johnson 2010-09-07