Issued Patents All Time
Showing 51–75 of 99 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7771693 | Diamond single crystal substrate manufacturing method | Kiichi Meguro, Takahiro Imai | 2010-08-10 |
| 7737614 | Diamond electron emission cathode, electron emission source, electron microscope, and electron beam exposure device | Akihiko Ueda, Yoshiki Nishibayashi, Takahiro Imai | 2010-06-15 |
| 7667977 | Mounting board, mounted body, and electronic equipment using the same | Yasuhiro Sugaya, Toshiyuki Asahi, Katsumasa Miki, Hiroyuki Ishitomi, Tsuyoshi Himori | 2010-02-23 |
| 7655208 | Single crystalline diamond and producing method thereof | Kiichi Meguro, Takahiro Imai | 2010-02-02 |
| 7615203 | Single crystal diamond | Kiichi Meguro, Takahiro Imai | 2009-11-10 |
| 7524372 | Method for manufacturing diamond single crystal substrate | Kiichi Meguro, Takahiro Imai | 2009-04-28 |
| 7481879 | Diamond single crystal substrate manufacturing method and diamond single crystal substrate | Kiichi Meguro, Takahiro Imai | 2009-01-27 |
| 7407549 | Diamond single crystal composite substrate and method for manufacturing the same | Kiichi Meguro, Takahiro Imai | 2008-08-05 |
| 7395190 | Analytical model producing method and analytical model producing apparatus | Masayuki Hariya, Yoshimitsu Hiro, Hiromitsu Tokisue | 2008-07-01 |
| 7390695 | Diamond substrate and manufacturing method thereof | Kiichi Meguro, Keisuke Tanizaki, Akihiko Namba, Takahiro Imai | 2008-06-24 |
| 7390692 | Semiconductor device and method for manufacturing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Seiichi Nakatani | 2008-06-24 |
| 7294587 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu, Seiichi Nakatani | 2007-11-13 |
| 7157789 | Semiconductor device and method for manufacturing the same | Koichi Hirano, Seiichi Nakatani, Toshiyuki Kojima, Shingo Komatsu | 2007-01-02 |
| 7141884 | Module with a built-in semiconductor and method for producing the same | Toshiyuki Kojima, Seiichi Nakatani, Yasuhiro Sugaya | 2006-11-28 |
| 7132756 | Semiconductor device and method for manufacturing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Seiichi Nakatani | 2006-11-07 |
| 7018866 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Seiichi Nakatani, Satoru Yuhaku +1 more | 2006-03-28 |
| 6975516 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Shingo Komatsu, Seiichi Nakatani | 2005-12-13 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Shingo Komatsu, Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi | 2005-02-15 |
| 6784530 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Shingo Komatsu, Seiichi Nakatani, Satoru Yuhaku +1 more | 2004-08-31 |
| 6716917 | Rubber-reinforced styrene transparent resin composition and method of producing the same | Ryota Kido, Hiroshi Shibata, Hajime Takamura, Akihiro Ohmura | 2004-04-06 |
| 6641861 | Heatsink and fabrication method thereof | Hirohisa Saito, Kiichi Meguro, Takahiro Imai | 2003-11-04 |
| 6483040 | Package and method of manufacturing the same | Satoshi Ooe | 2002-11-19 |
| 6361857 | Heatsink and fabrication method thereof | Hirohisa Saito, Kiichi Meguro, Takahiro Imai | 2002-03-26 |
| 6335863 | Package for semiconductors, and semiconductor module that employs the package | Hirohisa Saito, Takahiro Imai | 2002-01-01 |
| 6316826 | Semiconductor mounting package | Takahiro Imai | 2001-11-13 |