Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa +2 more | 2002-11-19 |
| 6328196 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa +2 more | 2001-12-11 |