Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261424 | Fixing structure of wiring member and wiring member | Hiroki Hirai, Makoto Higashikozono, Kosuke Sone, Hirokazu Komori | 2025-03-25 |
| 12126156 | Fixing structure of wiring member, and wiring member with joint member | Hiroki Hirai, Makoto Higashikozono, Kosuke Sone, Hirokazu Komori | 2024-10-22 |
| 12097810 | Wiring harness unit and wiring harness mounting structure | Satoshi Yamamoto | 2024-09-24 |
| 12071081 | Wire harness routing device | Satoshi Yamamoto, Kazuyoshi Ohara | 2024-08-27 |
| 12012145 | Travel controller and method for travel control | Takao Kashu, Yasutaka Teramae, Ryo Masutani, Ichi Gi | 2024-06-18 |
| 12009124 | Fixing structure of wiring member, and wiring member with heat generation layer | Hiroki Hirai, Makoto Higashikozono, Kosuke Sone | 2024-06-11 |
| 11975662 | Wire harness and wire harness routing apparatus | Satoshi Yamamoto, Makoto Higashikozono, Hidetoshi Ishida, Yasuyuki Otsuka, Toyoki FURUKAWA +1 more | 2024-05-07 |
| 11975663 | Wire harness routing apparatus | Masami ONO, Satoshi Yamamoto, Nahoko Furuhata | 2024-05-07 |
| 11955390 | Semiconductor wafer evaluation method and semiconductor wafer manufacturing method | Takahiro NAGASAWA, Yasuyuki Hashimoto | 2024-04-09 |
| 11946758 | Route selection device and method | Takao Kashu, Yasutaka Teramae, Shuichi Morimoto, Ryo Masutani, Ichi Gi | 2024-04-02 |
| 11915843 | Multicore cable | Jo YAGISAWA, Takumi OOSHIMA, Takaya Kohori | 2024-02-27 |
| 10220739 | Vehicle seat | Yoshikatsu Okuhara, Shinya Ito, Taku Imajo | 2019-03-05 |
| 9981581 | Vehicle seat | Yoshikatsu Okuhara, Shinya Ito, Taku Imajo | 2018-05-29 |
| 8888913 | Method of manufacturing epitaxial silicon wafer and apparatus therefor | Kazuhiro Narahara, Koichiro Hayashida | 2014-11-18 |
| 8021484 | Method of manufacturing epitaxial silicon wafer and apparatus therefor | Kazuhiro Narahara, Koichiro Hayashida | 2011-09-20 |
| 7993452 | Method of manufacturing epitaxial silicon wafer | Koichiro Hayashida, Kazuhiro Narahara | 2011-08-09 |
| 6250462 | Book-like disc casing | — | 2001-06-26 |
| 5948549 | Sinter joining method and sintered composite member produced by same | Takemori Takayama, Yuichi Hori | 1999-09-07 |
| 5932048 | Method of fabricating direct-bonded semiconductor wafers | Hiroshi Furukawa, Hiroaki Yamamoto, Kazuaki Fujimoto | 1999-08-03 |
| 5897743 | Jig for peeling a bonded wafer | Kazuaki Fujimoto, Hiroshi Furukawa | 1999-04-27 |
| 5849603 | Method of processing a surface of a semiconductor substrate | Yuji Sato, Kei Matsumoto | 1998-12-15 |
| 5770511 | Silicon-on-insulator substrate and a method for fabricating the same | Kei Matsumoto, Hiroshi Furukawa | 1998-06-23 |
| 5742176 | Method of measuring a Fe-B concentration of a silicon wafer | Kei Matsumoto | 1998-04-21 |
| 5742175 | Method of evaluating a density of oxygen-precipitation defects in a silicon wafer | Kei Matsumoto | 1998-04-21 |