Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5953620 | Method for fabricating a bonded SOI wafer | Hirotaka Katou, Hiroshi Furukawa | 1999-09-14 |
| 5932048 | Method of fabricating direct-bonded semiconductor wafers | Hiroshi Furukawa, Hirotaka Kato, Hiroaki Yamamoto | 1999-08-03 |
| 5897743 | Jig for peeling a bonded wafer | Hiroshi Furukawa, Hirotaka Kato | 1999-04-27 |