Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12377009 | Exoskeleton for upper arm | Andrea BALDONI, Matteo MOISE, Simona CREA, Emilio Trigili, Nicola VITIELLO +1 more | 2025-08-05 |
| 12299610 | Optimized task generation and scheduling of automated guided carts using overhead sensor systems | Enrico Fortunato, Ajith Abhindranath, Roberto Biale, Stefano La Rovere | 2025-05-13 |
| 11872176 | Exoskeleton for upper arm | Andrea BALDONI, Matteo MOISE, Simona CREA, Emilio Trigili, Nicola VITIELLO +1 more | 2024-01-16 |
| 11540969 | Ergonomic exoskeleton system for the upper limb | Marco Cempini, Nicola VITIELLO, Francesco GIOVACCHINI, Matteo MOISE | 2023-01-03 |
| 11432988 | Actuation system for hip orthosis | Nicola VITIELLO, Francesco GIOVACCHINI, Marco Cempini, Matteo FANTOZZI, Matteo MOISE +1 more | 2022-09-06 |
| 11413208 | Kinematical chain for assisting the motion of a spherical joint | Andrea BALDONI, Matteo FANTOZZI, Simona CREA, Francesco GIOVACCHINI, Nicola VITIELLO +2 more | 2022-08-16 |
| 10736809 | Ergonomic exoskeleton system for the upper limb | Marco Cempini, Nicola VITIELLO, Francesco GIOVACCHINI, Matteo MOISE | 2020-08-11 |
| 10603242 | Actuation system for hip orthosis | Nicola VITIELLO, Francesco GIOVACCHINI, Marco Cempini, Matteo FANTOZZI, Matteo MOISE +1 more | 2020-03-31 |
| 9096424 | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof | Sebastiano Conti, Benedetto Vigna | 2015-08-04 |
| 8854830 | Semiconductor package substrate in particular for MEMS devices | Federico Giovanni Ziglioli, Giovanni Graziosi | 2014-10-07 |
| 8847340 | Packaged sensor structure having sensor opening and package opening aligned with sensor element | Lorenzo Baldo, Chantal Combi | 2014-09-30 |
| 8837754 | Microelectromechanical transducer and corresponding assembly process | Kevin Formosa, Mark Anthony Azzopardi, Mark Andrew Shaw, Alex Gritti, Luca Maggi +1 more | 2014-09-16 |
| 8796059 | Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed | Lorenzo Baldo, Chantal Combi | 2014-08-05 |
| 8787600 | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof | Sebastiano Conti, Benedetto Vigna | 2014-07-22 |
| 8633583 | Semiconductor package substrate and methods for forming same, in particular for MEMS devices | Federico Giovanni Ziglioli, Giovanni Graziosi, Mark Andrew Shaw, Conrad Cachia | 2014-01-21 |
| 8546895 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo | 2013-10-01 |
| 8433084 | Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof | Sebastiano Conti, Benedetto Vigna | 2013-04-30 |
| 8411457 | Semiconductor package substrate | Federico Giovanni Ziglioli, Giovanni Graziosi | 2013-04-02 |
| 8134214 | Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates | Lorenzo Baldo, Chantal Combi | 2012-03-13 |
| 8124895 | Planar microelectromechanical device having a stopper structure for out-of-plane movements | Angelo Merassi, Viola Fulvio, Barbara Simoni, Andrea Rusconi Clerici Beltrami | 2012-02-28 |
| 8043881 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo | 2011-10-25 |
| 7875942 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Mark Anthony Azzopardi, Edward Myers, Chantal Combi, Lorenzo Baldo | 2011-01-25 |
| 7616451 | Semiconductor package substrate and method, in particular for MEMS devices | Federico Giovanni Ziglioli, Giovanni Graziosi | 2009-11-10 |