Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354998 | Packaged electronic system formed by electrically connected and galvanically isolated dice | Dario Paci, Silvia ADORNO, Marco Del Sarto, Fabrizio CERINI | 2025-07-08 |
| 12349302 | Electronic module carrying a plurality of electronic devices | Luca Maggi, Marco Del Sarto, Amedeo Maierna | 2025-07-01 |
| 12204092 | Integrated electronic module including two micromirrors, and system including the electronic module | Marco Del Sarto, Amedeo Maierna, Luca Maggi | 2025-01-21 |
| 11945714 | Electronic device and corresponding method | Marco Del Sarto | 2024-04-02 |
| 11309237 | Semiconductor package with wettable slot structures | Marco Del Sarto, Pierpaolo Recanatini, Michael Borg | 2022-04-19 |
| 10605684 | Multi-transducer modulus, electronic apparatus including the multi-transducer modulus and method for manufacturing the multi-transducer modulus | Marco Omar Ghidoni | 2020-03-31 |
| 10225635 | Microelectromechanical microphone | Roberto Brioschi, Kevin Formosa, Paul Anthony Barbara | 2019-03-05 |
| 9822001 | Process for manufacturing a lid for an electronic device package, and lid for an electronic device package | Paolo Crema | 2017-11-21 |
| 9428380 | Shielded encapsulating structure and manufacturing method thereof | Fulvio Vittorio Fontana, Giovanni Graziosi | 2016-08-30 |
| 9060227 | Shielded encapsulating structure and manufacturing method thereof | Fulvio Vittorio Fontana, Giovanni Graziosi | 2015-06-16 |
| 8837754 | Microelectromechanical transducer and corresponding assembly process | Kevin Formosa, Mark Anthony Azzopardi, Mario Cortese, Mark Andrew Shaw, Luca Maggi +1 more | 2014-09-16 |
| 7605476 | Stacked die semiconductor package | — | 2009-10-20 |