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Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device |
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2025-07-22 |
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Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device |
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2024-10-22 |
| 11977190 |
Scintillator radiation detector and corresponding dosimeter |
Sara Loi, Alessandro Freguglia |
2024-05-07 |
| 11948806 |
Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device |
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2024-04-02 |
| 11869832 |
Leadframe package using selectively pre-plated leadframe |
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2024-01-09 |
| 11756899 |
Lead frame surface finishing |
Jürgen Barthelmes, Din-Ghee Neoh |
2023-09-12 |
| 11640931 |
Die attachment method and material between a semiconductor device and die pad of a leadframe |
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2023-05-02 |
| 11610849 |
Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device |
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2023-03-21 |
| 11011476 |
Lead frame surface finishing |
Jürgen Barthelmes, Din-Ghee Neoh |
2021-05-18 |
| 10763195 |
Leadframe package using selectively pre-plated leadframe |
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2020-09-01 |
| 10408952 |
Radiation scintillator detector, detector package and manufacturing process thereof |
Alessandro Freguglia, Piero Giorgio Fallica |
2019-09-10 |
| 9822001 |
Process for manufacturing a lid for an electronic device package, and lid for an electronic device package |
Alex Gritti |
2017-11-21 |
| 9461011 |
Method and apparatus for manufacturing lead frames |
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2016-10-04 |
| 6468356 |
Method for removing molding residues in the fabrication of plastic packages for semiconductor devices |
Roberto Tiziani, Markus Guggenmos |
2002-10-22 |
| 6291893 |
"Power semiconductor device for ""flip-chip"" connections" |
Roberto Tiziani, Marco Mantovani |
2001-09-18 |
| 6221696 |
Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices |
Carlo Passagrilli |
2001-04-24 |
| 5789279 |
Method and apparatus for electrically insulating heat sinks in electronic power devices |
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1998-08-04 |