PC

Paolo Crema

SS Stmicroelectronics Sa: 16 patents #210 of 4,662Top 5%
SN Stmicroelectronics International N.V.: 2 patents #228 of 696Top 35%
SS Sgs-Thomson Microelectronics S.A.: 1 patents #534 of 957Top 60%
Overall (All Time): #265,753 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12368055 Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device 2025-07-22
12125803 Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device 2024-10-22
11977190 Scintillator radiation detector and corresponding dosimeter Sara Loi, Alessandro Freguglia 2024-05-07
11948806 Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device 2024-04-02
11869832 Leadframe package using selectively pre-plated leadframe 2024-01-09
11756899 Lead frame surface finishing Jürgen Barthelmes, Din-Ghee Neoh 2023-09-12
11640931 Die attachment method and material between a semiconductor device and die pad of a leadframe 2023-05-02
11610849 Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device 2023-03-21
11011476 Lead frame surface finishing Jürgen Barthelmes, Din-Ghee Neoh 2021-05-18
10763195 Leadframe package using selectively pre-plated leadframe 2020-09-01
10408952 Radiation scintillator detector, detector package and manufacturing process thereof Alessandro Freguglia, Piero Giorgio Fallica 2019-09-10
9822001 Process for manufacturing a lid for an electronic device package, and lid for an electronic device package Alex Gritti 2017-11-21
9461011 Method and apparatus for manufacturing lead frames 2016-10-04
6468356 Method for removing molding residues in the fabrication of plastic packages for semiconductor devices Roberto Tiziani, Markus Guggenmos 2002-10-22
6291893 "Power semiconductor device for ""flip-chip"" connections" Roberto Tiziani, Marco Mantovani 2001-09-18
6221696 Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices Carlo Passagrilli 2001-04-24
5789279 Method and apparatus for electrically insulating heat sinks in electronic power devices 1998-08-04