Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381372 | Electronic module for generating light pulses for LIDAR applications and method for manufacturing the electronic module | Romeo Letor, Alfio Russo, Antoine Pavlin, Nadia Lecci, Manuel Gaertner | 2025-08-05 |
| 12322684 | Method of manufacturing electronic devices and corresponding electronic device | Laurent Herard | 2025-06-03 |
| 12322603 | Method of manufacturing semiconductor devices and corresponding semiconductor device | Antonio BELLIZZI | 2025-06-03 |
| 12040263 | Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices | — | 2024-07-16 |
| 11749588 | Semiconductor device and corresponding method | Michele DERAI | 2023-09-05 |
| 11626379 | Method of manufacturing semiconductor devices and corresponding semiconductor device | Guendalina CATALANO | 2023-04-11 |
| 11557547 | Leadframe for semiconductor devices, corresponding semiconductor product and method | Mauro MAZZOLA | 2023-01-17 |
| 7803663 | Method for manufacturing a molded MMC multi media card package obtained with laser cutting | Giovanni Frezza | 2010-09-28 |
| 7459387 | Semiconductor electronic device and method of manufacturing thereof | Carlo Passagrilli | 2008-12-02 |
| 6909166 | Leads of a no-lead type package of a semiconductor device | Giovanni Frezza | 2005-06-21 |
| 6838755 | Leadframe for integrated circuit chips having low resistance connections | Carlo Cognetti, Andrea Cigada | 2005-01-04 |
| 6815789 | Semiconductor electronic device and method of manufacturing thereof | Carlo Passagrilli | 2004-11-09 |
| 6593665 | Protective envelope for a semiconductor integrated circuit | Marzio Terzoli | 2003-07-15 |
| 6468356 | Method for removing molding residues in the fabrication of plastic packages for semiconductor devices | Paolo Crema, Markus Guggenmos | 2002-10-22 |
| 6291893 | "Power semiconductor device for ""flip-chip"" connections" | Paolo Crema, Marco Mantovani | 2001-09-18 |
| 6195256 | Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink | Roberto Rossi, Claudio Maria Villa | 2001-02-27 |