Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE46671 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device | Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra +1 more | 2018-01-16 |
| 8847340 | Packaged sensor structure having sensor opening and package opening aligned with sensor element | Lorenzo Baldo, Mario Cortese | 2014-09-30 |
| 8796059 | Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed | Lorenzo Baldo, Mario Cortese | 2014-08-05 |
| 8546895 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo | 2013-10-01 |
| 8134214 | Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates | Lorenzo Baldo, Mario Cortese | 2012-03-13 |
| 8049287 | Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device | Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra +1 more | 2011-11-01 |
| 8043881 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo | 2011-10-25 |
| 8044929 | Analog data-input device provided with a pressure sensor of a microelectromechanical type | Lorenzo Baldo, Simone Sassolini, Marco Del Sarto | 2011-10-25 |
| 7928960 | Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device | Lorenzo Baldo, Dino Faralli | 2011-04-19 |
| 7875942 | Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type | Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo | 2011-01-25 |
| 7678600 | Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate | Flavio Francesco Villa, Pietro Corona, Lorenzo Baldo, Gabriele Barlocchi | 2010-03-16 |
| 7489004 | Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness | Andrea Rusconi Clerici Beltrami, Benedetto Vigna | 2009-02-10 |
| 7421904 | Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device | Federico Giovanni Ziglioli, Lorenzo Baldo, Caterina Riva, Mark Andrew Shaw | 2008-09-09 |
| 7343805 | Surface acoustic wave pressure sensor | Simona Petroni, Anna Angela Pomarico, Lorenzo Baldo | 2008-03-18 |
| 7322236 | Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device | Lorenzo Baldo, Dino Faralli, Flavio Francesco Villa | 2008-01-29 |
| 7242066 | Manufacturing method of a microelectromechanical switch | Benedetto Vigna | 2007-07-10 |
| 7022542 | Manufacturing method of a microelectromechanical switch | Benedetto Vigna | 2006-04-04 |
| 6869856 | Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling | Matteo Fiorito, Marta Mottura, Giuseppe Visalli, Benedetto Vigna | 2005-03-22 |