Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Chantal Combi — 18 Patents

SSStmicroelectronics Sa: 18 patents #267 of 4,662Top 6%
S(Stmicroelectronics (Malta): 3 patents #9 of 49Top 20%
Lecco, IT: #6 of 154 inventorsTop 4%
Overall (All Time): #245,716 of 4,157,543Top 6%
18 Patents All Time
Chantal Combi has been granted 18 US patents while listed as an inventor at Stmicroelectronics Sa. The first was granted in 2005 and the most recent in January 2018. Chantal Combi ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Chantal Combi in Lecco, IT.

Patents per Year

Patents granted per year, 2005 to 2018Bar chart with a peak of 5 patents in 2011.peak 52005: 1 patents20052006: 1 patents2007: 1 patents20072008: 3 patents2009: 1 patents20092010: 1 patents2011: 5 patents20112012: 1 patents2013: 1 patents20132014: 2 patents2018: 1 patents2018

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
RE46671 Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra +1 more 2018-01-16
8847340 Packaged sensor structure having sensor opening and package opening aligned with sensor element Lorenzo Baldo, Mario Cortese 2014-09-30 $3,988,000
8796059 Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed Lorenzo Baldo, Mario Cortese 2014-08-05 $3,011,000
8546895 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo 2013-10-01 $15,661,000
8134214 Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates Lorenzo Baldo, Mario Cortese 2012-03-13 $10,156,000
8049287 Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra +1 more 2011-11-01 $4,374,000
8043881 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo 2011-10-25 $1,868,000
8044929 Analog data-input device provided with a pressure sensor of a microelectromechanical type Lorenzo Baldo, Simone Sassolini, Marco Del Sarto 2011-10-25 $1,868,000
7928960 Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device Lorenzo Baldo, Dino Faralli 2011-04-19 $6,186,000
7875942 Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo 2011-01-25 $6,148,000
7678600 Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate Flavio Francesco Villa, Pietro Corona, Lorenzo Baldo, Gabriele Barlocchi 2010-03-16 $5,370,000
7489004 Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness Andrea Rusconi Clerici Beltrami, Benedetto Vigna 2009-02-10 $4,440,000
7421904 Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device Federico Giovanni Ziglioli, Lorenzo Baldo, Caterina Riva, Mark Andrew Shaw 2008-09-09 $5,050,000
7343805 Surface acoustic wave pressure sensor Simona Petroni, Anna Angela Pomarico, Lorenzo Baldo 2008-03-18 $4,109,000
7322236 Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device Lorenzo Baldo, Dino Faralli, Flavio Francesco Villa 2008-01-29 $4,582,000
7242066 Manufacturing method of a microelectromechanical switch Benedetto Vigna 2007-07-10 $10,292,000
7022542 Manufacturing method of a microelectromechanical switch Benedetto Vigna 2006-04-04 $4,693,000
6869856 Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling Matteo Fiorito, Marta Mottura, Giuseppe Visalli, Benedetto Vigna 2005-03-22 $10,073,000