Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed

US Patent 8796059 · Granted Aug 5, 2014

Estimated economic value: $3,011,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Linear capacitive pressure sensor2025
Exoskeleton for upper arm2025
Optimized task generation and scheduling of automated guided carts using overhea2025
MEMS optical device comprising a lens and an actuator for controlling the curvat2024
Semiconductor device and method for manufacturing a semiconductor device2024
Semiconductor integrated device with electrical contacts between stacked dies an2024
Exoskeleton for upper arm2024
Mems device having a rugged package and fabrication process thereof2024
MEMS optical device comprising a lens and an actuator for controlling the curvat2023
Method of processing a wafer for manufacturing an oscillating structure such as 2023
Waterproof switch actuatable by a fluid such as air and usable in particular for2023
Micropump MEMS device for moving or ejecting a fluid, in particular microblower 2023