Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10882738 | Wafer level package for a mems sensor device and corresponding manufacturing process | David Vella, Damian Agius, Maria Spiteri | 2021-01-05 |
| 10435290 | Wafer level package for a MEMS sensor device and corresponding manufacturing process | David Vella, Damian Agius, Maria Spiteri | 2019-10-08 |
| 9802813 | Wafer level package for a MEMS sensor device and corresponding manufacturing process | David Vella, Damian Agius, Maria Spiteri | 2017-10-31 |
| 9527727 | Packages for semiconductor devices and methods for assembling same | — | 2016-12-27 |
| 9290377 | Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device | Kenneth Fonk | 2016-03-22 |
| 8748291 | Method for strip testing of MEMS devices, testing strip of MEMS devices and MEMS device thereof | Mark Anthony Azzopardi, Stefano Pozzi | 2014-06-10 |
| 8633583 | Semiconductor package substrate and methods for forming same, in particular for MEMS devices | Federico Giovanni Ziglioli, Giovanni Graziosi, Mark Andrew Shaw, Mario Cortese | 2014-01-21 |