Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packages for semiconductor devices and methods for assembling same

Packages for semiconductor devices and methods for assembling same

US Patent 9527727 · Granted Dec 27, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer level package for a mems sensor device and corresponding manufacturing pro2021
Wafer level package for a MEMS sensor device and corresponding manufacturing pro2019
Wafer level package for a MEMS sensor device and corresponding manufacturing pro2017
Method of stacking a plurality of dies to form a stacked semiconductor device, a2016
Method for strip testing of MEMS devices, testing strip of MEMS devices and MEMS2014
Semiconductor package substrate and methods for forming same, in particular for 2014