Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10886210 | Cover for an electronic device and method of fabrication | — | 2021-01-05 |
| 10865962 | Protection mechanism for light source | Jean-Michel Riviere | 2020-12-15 |
| 10777710 | Protection mechanism for light source | Jean-Michel Riviere | 2020-09-15 |
| 10738985 | Housing for light source | Joseph Hannan, Stuart Robertson, Jean-Michel Riviere | 2020-08-11 |
| 9502361 | Electronic device with stacked chips | Julien Pruvost | 2016-11-22 |
| 9478677 | Electronic device comprising an optical sensor chip | Julien Pruvost | 2016-10-25 |
| 9401349 | Stack of integrated-circuit chips and electronic device | Angelo Crobu, Kenneth Fonk | 2016-07-26 |
| 9245914 | Electronic device comprising a chip of integrated circuits stacked with an optical plate | Olivier Le-Briz | 2016-01-26 |
| 9136292 | Optical electronic package having a blind cavity for covering an optical sensor | Remi Brechignac | 2015-09-15 |
| 9134421 | Substrate wafer with optical electronic package | Julien Vittu | 2015-09-15 |
| 9105766 | Optical electronic package | Eric Saugier, Hk Looi, Norbert Chevrier | 2015-08-11 |
| 9076749 | Electronic system comprising stacked electronic devices comprising integrated-circuit chips | Remi Brechignac | 2015-07-07 |
| 9029928 | Semiconductor device comprising a passive component of capacitors and process for fabrication | Laurent Marechal, Yvon Imbs | 2015-05-12 |
| 9006904 | Dual side package on package | Dominique Marais, Jacques Chavade, Remi Brechignac, Eric Saugier, Luc Petit | 2015-04-14 |
| 8928148 | Semiconductor component and device provided with heat dissipation means | Yann Guillou | 2015-01-06 |
| 8860207 | Method of fabricating land grid array semiconductor package | Yonggang Jin, Jerome Teysseyre | 2014-10-14 |
| 8847243 | Semiconductor package comprising an optical semiconductor device | Emmanuelle Vigier-Blanc | 2014-09-30 |
| 8786084 | Semiconductor package and method of forming | Jean-François Sauty | 2014-07-22 |
| 8754523 | Surface-mounted electronic component | — | 2014-06-17 |
| 8716739 | Optical electronic package with an optically isolated chamber | Julien Vittu | 2014-05-06 |
| 8664044 | Method of fabricating land grid array semiconductor package | Yonggang Jin, Jerome Teysseyre | 2014-03-04 |
| 8482116 | Semiconductor device having stacked components | Remi Brechignac, Carlo C. De Martiis | 2013-07-09 |
| 8232113 | Method for manufacturing and testing an integrated electronic circuit | — | 2012-07-31 |
| 8227332 | Method for fabricating electrical bonding pads on a wafer | Jacky Seiller, Gil Provent | 2012-07-24 |
| 8148258 | Method for fabricating electrical bonding pads on a wafer | Jacky Seiller, Gil Provent | 2012-04-03 |