Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10186466 | Electronic device comprising an encapsulating block locally of smaller thickness | Benoit Besancon | 2019-01-22 |
| 9818664 | Electronic device comprising an encapsulating block locally of smaller thickness | Benoit Besancon | 2017-11-14 |
| 9006904 | Dual side package on package | Dominique Marais, Jacques Chavade, Remi Brechignac, Eric Saugier, Romain Coffy | 2015-04-14 |
| 6528407 | Process for producing electrical-connections on a semiconductor package, and semiconductor package | Alexandre Castellane | 2003-03-04 |
| 6399475 | Process for producing electrical connections on the surface of a semiconductor package with electrical-connection drops | — | 2002-06-04 |
| 6049971 | Casing for integrated circuit chips and method of fabrication | — | 2000-04-18 |
| 5959355 | Semiconductor package having mechanically and electrically bonded supportive elements | — | 1999-09-28 |