| 11688815 |
Method for manufacturing a cover for an electronic package and electronic package comprising a cover |
Karine Saxod, Alexandre Mas, Gaetan Lobascio, Benoit Besancon |
2023-06-27 |
| 10978400 |
Conductive vias |
— |
2021-04-13 |
| 10955289 |
Electronic module including an ambient light sensor stacked over a proximity sensor |
William Halliday, Roy Duffy |
2021-03-23 |
| 10833208 |
Method for manufacturing a cover for an electronic package and electronic package comprising a cover |
Karine Saxod, Alexandre Mas, Gaetan Lobascio, Benoit Besancon |
2020-11-10 |
| 10811349 |
Electronic device including at least one electronic chip and electronic package |
David Auchere, Laurent Schwarz, Deborah COGONI |
2020-10-20 |
| 10483408 |
Method for making a cover for an electronic package and electronic package comprising a cover |
Karine Saxod, Alexandre Mas, Gaetan Lobascio, Benoit Besancon |
2019-11-19 |
| 9525094 |
Proximity and ranging sensor |
Wing Shenq Wong, David Gani |
2016-12-20 |
| 9105766 |
Optical electronic package |
Romain Coffy, Hk Looi, Norbert Chevrier |
2015-08-11 |
| 9006904 |
Dual side package on package |
Dominique Marais, Jacques Chavade, Remi Brechignac, Romain Coffy, Luc Petit |
2015-04-14 |
| 8928893 |
Proximity sensor |
Ewan Findlay, Colin Campbell, Gemma Ramsey |
2015-01-06 |
| 8586450 |
Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias |
— |
2013-11-19 |
| 8098445 |
Focussing apparatus |
Colin Campbell |
2012-01-17 |
| 7880132 |
Cap including a housing and optically transparent member to protect a camera module lens |
Stuart Brodie, Hazel McInnes, Kum-Weng Loo, Mickael Miglietti |
2011-02-01 |
| 7668449 |
Barrel of variable focal length lens |
Jean-Luc Diot, Fabrice Mee |
2010-02-23 |
| 7393215 |
Assembly of a mobile objective above an optical sensor |
— |
2008-07-01 |