Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8227332 | Method for fabricating electrical bonding pads on a wafer | Romain Coffy, Gil Provent | 2012-07-24 |
| 8148258 | Method for fabricating electrical bonding pads on a wafer | Romain Coffy, Gil Provent | 2012-04-03 |
| 7919864 | Forming of the last metallization level of an integrated circuit | Jean-François Revel, Claude Douce | 2011-04-05 |