Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6360687 | Wafer flattening system | Michihiko Yanagisawa, Chikai Tanaka, Shinya Iida, Yasuhiro Horiike | 2002-03-26 |
| 6303511 | Wafer flattening process | Michihiko Yanagisawa | 2001-10-16 |