Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9004135 | Method and apparatus for bonding together two wafers by molecular adhesion | Arnaud Castex | 2015-04-14 |
| 8932938 | Method of fabricating a multilayer structure with circuit layer transfer | Arnaud Castex | 2015-01-13 |
| 8927320 | Method of bonding by molecular bonding | Chrystelle Lagahe Blanchard, Arnaud Castex | 2015-01-06 |
| 8871611 | Method for molecular adhesion bonding at low pressure | — | 2014-10-28 |
| 8679944 | Progressive trimming method | Marion Migette, Sebastien Molinari, Eric Neyret | 2014-03-25 |
| 8575002 | Direct bonding method with reduction in overlay misalignment | Gweltaz Gaudin, Arnaud Castex | 2013-11-05 |
| 8357589 | Method of thinning a structure | — | 2013-01-22 |
| 8338266 | Method for molecular adhesion bonding at low pressure | — | 2012-12-25 |
| 8232130 | Process for assembling wafers by means of molecular adhesion | Bernard Aspar, Thierry Barge, Chrystelle Lagahe Blanchard | 2012-07-31 |
| 8202785 | Surface treatment for molecular bonding | Arnaud Castex, Gweltaz Gaudin | 2012-06-19 |
| 8163570 | Method of initiating molecular bonding | Arnaud Castex | 2012-04-24 |
| 7768129 | Metal etching method for an interconnect structure and metal interconnect structure obtained by such method | Arnoud Fortuin | 2010-08-03 |
| 6939812 | Method of forming an etch stop layer in a semiconductor device | Josephus Franciscus Antonius Maria Guelen, Eric Gerritsen | 2005-09-06 |