Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854476 | Semiconductor vertical wire bonding structure and method | Han-Min Huang, Yenheng Chen, Chengtar Wu | 2020-12-01 |
| 10804229 | Fan-out antenna package structure and packaging method | Yenheng Chen, Chengtar Wu | 2020-10-13 |
| 10777516 | Fan-out antenna packaging structure and packaging method | Yenheng Chen, Chengtar Wu | 2020-09-15 |
| 10777515 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Jangshen Lin, Chengtar Wu, Chihon Ho | 2020-09-15 |
| 10777876 | Antenna feeder package structure and packaging method | Jangshen Lin, Yenheng Chen, Chengtar Wu | 2020-09-15 |
| 10770394 | Fan-out semiconductor packaging structure with antenna module and method making the same | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2020-09-08 |
| 10714435 | Fan-out antenna packaging structure and method making the same | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2020-07-14 |
| 10636779 | Packaging device for integrated power supply system and packaging method thereof | Jangshen Lin, Chihhung Ho, Qifeng Cai | 2020-04-28 |
| 10593641 | Package method and package structure of fan-out chip | Yuedong Qiu | 2020-03-17 |
| 10573609 | Fan-out antenna packaging structure and preparation thereof | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2020-02-25 |
| 10553458 | Chip packaging method | Yuedong Qiu | 2020-02-04 |
| 10325786 | Double-sided plastic fan-out package structure having antenna and manufacturing method thereof | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2019-06-18 |
| 10290515 | Wafer level chip packaging method | Yuedong Qiu | 2019-05-14 |
| 10056350 | Fan-out package structure, and manufacturing method thereof | Qifeng Cai | 2018-08-21 |