Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636779 | Packaging device for integrated power supply system and packaging method thereof | Jangshen Lin, Chengchung Lin, Chihhung Ho | 2020-04-28 |
| 10056350 | Fan-out package structure, and manufacturing method thereof | Chengchung Lin | 2018-08-21 |