Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283493 | Packaging structure radiating electromagnetic waves in horizontal direction and method making the same | Yenheng Chen | 2025-04-22 |
| 12198942 | Packaging structure and method for preparing same | Jangshen Lin, Yenheng Chen | 2025-01-14 |
| 12132036 | Fan-out LED packaging structure and method | Hanlung Tsai, Xingtao Xue | 2024-10-29 |
| 12119295 | Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof | Yenheng Chen | 2024-10-15 |
| 12113045 | Three-dimensional stacked fan-out packaging structure and method making the same | Yenheng Chen | 2024-10-08 |
| 12040546 | Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same | Yenheng Chen | 2024-07-16 |
| 11973070 | Double-layer stacked 3D fan-out packaging structure and method making the same | Yenheng Chen | 2024-04-30 |
| 11973046 | Semiconductor structure and method for preparing the same | Jiashan Yin, Zuyuan Zhou, Xingtao Xue | 2024-04-30 |
| 11894243 | Wafer system-level fan-out packaging structure and manufacturing method | Yenheng Chen | 2024-02-06 |
| 11894357 | System-level packaging structure and method for LED chip | Yenheng Chen | 2024-02-06 |
| 11842976 | Semiconductor package structure with heat sink and method preparing the same | Hanlung Tsai, Mingchih Chen | 2023-12-12 |
| 11798888 | Chip packaging structure and method for preparing same | Yayuan Xue, Xingtao Xue | 2023-10-24 |
| 11756942 | Fan-out packaging structure and method | Yenheng Chen | 2023-09-12 |
| 11756871 | Fan-out packaging structure and method | Yenheng Chen | 2023-09-12 |
| 11749657 | Fan-out packaging structure and method | Yenheng Chen | 2023-09-05 |
| 11735564 | Three-dimensional chip packaging structure and method thereof | Yenheng Chen, Chengtar Wu | 2023-08-22 |
| 11728158 | Semiconductor structure and method for preparing the same | Jiashan Yin, Zuyuan Zhou, Xingtao Xue | 2023-08-15 |
| 11728558 | Semiconductor structure including antenna | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2023-08-15 |
| 11699840 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2023-07-11 |
| 11626657 | Antenna packaging module and making method thereof | Chengtar Wu, Rui Yu, Xianghui Zhang | 2023-04-11 |
| 11605604 | Fan-out antenna packaging structure and packaging method | Yenheng Chen | 2023-03-14 |
| 11515269 | Semiconductor packaging structure having antenna module | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2022-11-29 |
| 11508675 | Semiconductor package structure having antenna module | Yenheng Chen, Chentar Wu | 2022-11-22 |
| 11502392 | Packaging structure and packaging method for antenna | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2022-11-15 |
| 11488915 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2022-11-01 |