Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132036 | Fan-out LED packaging structure and method | Hanlung Tsai, Chengchung Lin | 2024-10-29 |
| 11973046 | Semiconductor structure and method for preparing the same | Jiashan Yin, Zuyuan Zhou, Chengchung Lin | 2024-04-30 |
| 11798888 | Chip packaging structure and method for preparing same | Yayuan Xue, Chengchung Lin | 2023-10-24 |
| 11728158 | Semiconductor structure and method for preparing the same | Jiashan Yin, Zuyuan Zhou, Chengchung Lin | 2023-08-15 |
| 10312208 | Copper pillar bump structure and manufacturing method therefor | Chih Ching Ho | 2019-06-04 |