Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283493 | Packaging structure radiating electromagnetic waves in horizontal direction and method making the same | Chengchung Lin | 2025-04-22 |
| 12198942 | Packaging structure and method for preparing same | Jangshen Lin, Chengchung Lin | 2025-01-14 |
| 12119295 | Wafer system-level three-dimensional fan-out three-dimensional fan-out packaging structure and manufacturing method thereof | Chengchung Lin | 2024-10-15 |
| 12113045 | Three-dimensional stacked fan-out packaging structure and method making the same | Chengchung Lin | 2024-10-08 |
| 12040546 | Packaging structure radiating electromagnetic wave in horizontal direction and vertical direction and method making the same | Chengchung Lin | 2024-07-16 |
| 11973070 | Double-layer stacked 3D fan-out packaging structure and method making the same | Chengchung Lin | 2024-04-30 |
| 11894357 | System-level packaging structure and method for LED chip | Chengchung Lin | 2024-02-06 |
| 11894243 | Wafer system-level fan-out packaging structure and manufacturing method | Chengchung Lin | 2024-02-06 |
| 11756942 | Fan-out packaging structure and method | Chengchung Lin | 2023-09-12 |
| 11756871 | Fan-out packaging structure and method | Chengchung Lin | 2023-09-12 |
| 11749657 | Fan-out packaging structure and method | Chengchung Lin | 2023-09-05 |
| 11735554 | Wafer-level chip scale packaging structure having a rewiring layer and method for manufacturing the wafer-level chip scale packaging structure | Chenguang Yin | 2023-08-22 |
| 11735564 | Three-dimensional chip packaging structure and method thereof | Chengchung Lin, Chengtar Wu | 2023-08-22 |
| 11728558 | Semiconductor structure including antenna | Chengtar Wu, Jangshen Lin, Chengchung Lin | 2023-08-15 |
| 11699840 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2023-07-11 |
| 11605604 | Fan-out antenna packaging structure and packaging method | Chengchung Lin | 2023-03-14 |
| 11515269 | Semiconductor packaging structure having antenna module | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-11-29 |
| 11508675 | Semiconductor package structure having antenna module | Chentar Wu, Chengchung Lin | 2022-11-22 |
| 11502392 | Packaging structure and packaging method for antenna | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-11-15 |
| 11488915 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-11-01 |
| 11437707 | Antenna feeder package structure and packaging method | Jangshen Lin, Chengchung Lin, Chengtar Wu | 2022-09-06 |
| 11322852 | Lens antenna packaging structure, preparation method and electronic device | Jangshen Lin, Chengchung Lin, Chengtar Wu | 2022-05-03 |
| 11316247 | Semiconductor packaging structure having antenna module | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-04-26 |
| 11316252 | Antenna packaging structure and method for forming the same | Chengtar Wu, Chengchung Lin, Yayuan Xue, Han Xu | 2022-04-26 |
| 11302658 | Fan-out antenna package structure and packaging method | Chengchung Lin, Chengtar Wu | 2022-04-12 |