Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735554 | Wafer-level chip scale packaging structure having a rewiring layer and method for manufacturing the wafer-level chip scale packaging structure | Yenheng Chen | 2023-08-22 |
| 11032287 | Delegated administrator with defined permission boundaries in a permission boundary policy attachment for web services and resources | Mingkun Wang, Jasmeet Chhabra, Hang Li, Dan Popick, Alazel Acheson +3 more | 2021-06-08 |