Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289435 | Fan-out antenna packaging structure and packaging method | Chengchung Lin, Chengtar Wu | 2022-03-29 |
| 11289793 | Semiconductor packaging structure having antenna module | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-03-29 |
| 11283152 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-03-22 |
| 11257772 | Fan-out antenna packaging structure and preparation method thereof | Chengchung Lin, Jangshen Lin, Chengtar Wu, Chihon Ho | 2022-02-22 |
| 11228087 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2022-01-18 |
| 11211343 | Fan-out antenna packaging structure and packaging method | Chengchung Lin | 2021-12-28 |
| 11211687 | Method of fabricating a semiconductor structure with an antenna module | Chengtar Wu, Jangshen Lin, Chengchung Lin | 2021-12-28 |
| 11133568 | Semiconductor package structure having antenna module | Chengtar Wu, Chengchung Lin | 2021-09-28 |
| 11121065 | Semiconductor packaging structure with antenna assembly | Chentar Wu, Chengchung Lin | 2021-09-14 |
| 11114391 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2021-09-07 |
| 10916829 | Semiconductor package structure having antenna module | Chengtar Wu, Chengchung Lin | 2021-02-09 |
| 10886243 | Fan-out antenna packaging structure and preparation thereof | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2021-01-05 |
| 10886594 | Packaging structure and packaging method for antenna | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2021-01-05 |
| 10872868 | Fan-out antenna packaging structure and preparation method thereof | Chengchung Lin, Jangshen Lin, Chengtar Wu, Chihon Ho | 2020-12-22 |
| 10872867 | Fan-out antenna packaging structure and preparation method thereof | Chengchung Lin, Jangshen Lin, Chengtar Wu, Chihon Ho | 2020-12-22 |
| 10854476 | Semiconductor vertical wire bonding structure and method | Han-Min Huang, Chengchung Lin, Chengtar Wu | 2020-12-01 |
| 10854951 | Antenna package structure and antenna packaging method | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2020-12-01 |
| 10804229 | Fan-out antenna package structure and packaging method | Chengchung Lin, Chengtar Wu | 2020-10-13 |
| 10777516 | Fan-out antenna packaging structure and packaging method | Chengchung Lin, Chengtar Wu | 2020-09-15 |
| 10777876 | Antenna feeder package structure and packaging method | Jangshen Lin, Chengchung Lin, Chengtar Wu | 2020-09-15 |
| 10777515 | Fan-out antenna packaging structure and preparation method thereof | Chengchung Lin, Jangshen Lin, Chengtar Wu, Chihon Ho | 2020-09-15 |
| 10770394 | Fan-out semiconductor packaging structure with antenna module and method making the same | Chengtar Wu, Jangshen Lin, Chengchung Lin | 2020-09-08 |
| 10714435 | Fan-out antenna packaging structure and method making the same | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2020-07-14 |
| 10573609 | Fan-out antenna packaging structure and preparation thereof | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2020-02-25 |
| 10325786 | Double-sided plastic fan-out package structure having antenna and manufacturing method thereof | Chengchung Lin, Chengtar Wu, Jangshen Lin | 2019-06-18 |