Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756922 | Hybrid bonding structure and hybrid bonding method | Ran He, Huifang Jiao, Yufeng Dai, Guanglin Yang, Ronghua Xie | 2023-09-12 |
| 11257772 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chengtar Wu | 2022-02-22 |
| 10872867 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chengtar Wu | 2020-12-22 |
| 10872868 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chengtar Wu | 2020-12-22 |
| 10777515 | Fan-out antenna packaging structure and preparation method thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin, Chengtar Wu | 2020-09-15 |