Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971467 | Packaging method and package structure of fan-out chip | Chengchung Lin | 2021-04-06 |
| 10593641 | Package method and package structure of fan-out chip | Chengchung Lin | 2020-03-17 |
| 10553458 | Chip packaging method | Chengchung Lin | 2020-02-04 |
| 10290515 | Wafer level chip packaging method | Chengchung Lin | 2019-05-14 |