Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9131267 | Apparatus and method of portable terminal for dual display of broadcasting receiver by HDMI signal | Sang Mi Park, Hyun-Ho Park, Woo Yoo | 2015-09-08 |
| 8846380 | Reaction cassette for measuring the concentration of glycated hemoglobin and measuring method thereof | Byeong-Woo Bae, Sung-dong Lee, Min Sun Kim, Jae-Hyun Yoo, Hyoung Soo Kim +1 more | 2014-09-30 |
| 8842745 | Transmission unit adopting a differential voltage driving system, transmission unit and receiving unit selectively adopting a differential current driving system, differential voltage driving system, and interface system | Jun Ho Kim, Jung-Hwan Choi | 2014-09-23 |
| 8704350 | Stacked wafer level package and method of manufacturing the same | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Hee Kon Lee, Hyung Jin Jeon +2 more | 2014-04-22 |
| 8658467 | Method of manufacturing stacked wafer level package | Seung Wook Park, Young Do Kweon, Jin Gu Kim, Hee Kon Lee, Hyung Jin Jeon +2 more | 2014-02-25 |
| 8624128 | Printed circuit board and manufacturing method thereof | Young Do Kweon, Jin Gu Kim, Seon Hee Moon, Dong Jin Lee, Seung Wook Park | 2014-01-07 |
| 8400194 | Interface system for a cog application | Jung-Hwan Choi, Jun Ho Kim | 2013-03-19 |
| 8367023 | Reagent vessel | Byeong-Woo Bae, Sung-dong Lee, Min Sun Kim, Jae-Hyun Yoo, Hyoung Soo Kim +1 more | 2013-02-05 |
| 8324936 | Transmitter and receiver of differential current driving mode, and interface system of differential current driving mode including the same | Jun Ho Kim, Young Soo Ryu, Jung-Hwan Choi | 2012-12-04 |
| 8309399 | Power semiconductor module and method of manufacturing the same | Shan Gao, Seog Moon Choi, Tae Hyun Kim, Bum Sik Jang, Ji Hyun Park | 2012-11-13 |
| 8273660 | Method of manufacturing a dual face package | Seung Wook Park, Young Do Kweon, Jingli Yuan, Seon Hee Moon, Jae Kwang Lee | 2012-09-25 |
| 8093705 | Dual face package having resin insulating layer | Seung Wook Park, Young Do Kweon, Jingli Yuan, Seon Hee Moon, Jae Kwang Lee | 2012-01-10 |
| 8058722 | Power semiconductor module and method of manufacturing the same | Shan Gao, Seog Moon Choi, Tae Hyun Kim, Bum Sik Jang, Ji Hyun Park | 2011-11-15 |
| 7911043 | Wafer level device package with sealing line having electroconductive pattern and method of packaging the same | Seog Moon Choi, Tae Hoon Kim, Job Ha, Seung Wook Park | 2011-03-22 |