Issued Patents All Time
Showing 1–25 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7803020 | Backplane system having high-density electrical connectors | Maria M. Portuondo, Willard Erickson, Maurice Bizzarri | 2010-09-28 |
| 7253365 | Die package for connection to a substrate | Myoung-soo Jeon, Charley T. Ogata | 2007-08-07 |
| 7183646 | Semiconductor chip carrier affording a high-density external interface | Maria M. Portuondo | 2007-02-27 |
| 7135768 | Hermetic seal | Myoung-soo Jeon, Matthew Doty | 2006-11-14 |
| 7123465 | Decoupling capacitor for an integrated circuit and method of manufacturing thereof | Zsolt Horvath, Josh Nickel, Myoung-soo Jeon, Charley T. Ogata, Vincent Alcaria +1 more | 2006-10-17 |
| 7103753 | Backplane system having high-density electrical connectors | — | 2006-09-05 |
| 7070340 | High performance optoelectronic packaging assembly | Myoung-soo Jeon, Joshua G. Nickel, Zsolt Horvath | 2006-07-04 |
| 6977432 | Prefabricated semiconductor chip carrier | Maria M. Portuondo | 2005-12-20 |
| 6905367 | Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same | Myoung-soo Jeon, Josh Nickel | 2005-06-14 |
| 6857173 | Apparatus for and method of manufacturing a semiconductor die carrier | Daniel Larcomb, Lakshminarasimha Krishnapura | 2005-02-22 |
| 6847115 | Packaged semiconductor device for radio frequency shielding | Myoung-soo Jeon, Vicente D. Alcaria | 2005-01-25 |
| 6828511 | Prefabricated semiconductor chip carrier | Maria M. Portuondo | 2004-12-07 |
| 6803650 | Semiconductor die package having mesh power and ground planes | Myoung-soo Jeon, Charley T. Ogata, Ton-Yong Wang, Andreas Cangellaris, Jose Schutt-Aine | 2004-10-12 |
| 6797882 | Die package for connection to a substrate | Myoung-soo Jeon, Charley T. Ogata | 2004-09-28 |
| 6734546 | Micro grid array semiconductor die package | Vicente D. Alcaria, Myoung-soo Jeon | 2004-05-11 |
| 6700138 | Modular semiconductor die package and method of manufacturing thereof | Jennifer Colegrove, Zsolt Horvath, Myoung-soo Jeon, Joshua G. Nickel, Lei Yang | 2004-03-02 |
| 6679733 | Electrical connector having electrically conductive shielding | Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link | 2004-01-20 |
| 6663294 | Optoelectronic packaging assembly | Zsolt Horvath | 2003-12-16 |
| 6603193 | Semiconductor package | Myoung-soo Jeon, Vicente D. Alcaria | 2003-08-05 |
| 6577003 | Semiconductor chip carrier affording a high-density external interface | Maria M. Portuondo | 2003-06-10 |
| 6574726 | Modular architecture for high bandwidth computers | — | 2003-06-03 |
| 6554651 | High-density electrical interconnect system | — | 2003-04-29 |
| 6475832 | Open-cavity semiconductor die package | Lakshminarasimha Krishnapura, Yun Li | 2002-11-05 |
| 6461197 | Female contact pin including flexible contact portion | Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link | 2002-10-08 |
| 6421254 | Multi-chip module having interconnect dies | Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn | 2002-07-16 |