Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7253365 | Die package for connection to a substrate | Stanford W. Crane, Jr., Charley T. Ogata | 2007-08-07 |
| 7135768 | Hermetic seal | Stanford W. Crane, Jr., Matthew Doty | 2006-11-14 |
| 7123465 | Decoupling capacitor for an integrated circuit and method of manufacturing thereof | Stanford W. Crane, Jr., Zsolt Horvath, Josh Nickel, Charley T. Ogata, Vincent Alcaria +1 more | 2006-10-17 |
| 7070340 | High performance optoelectronic packaging assembly | Stanford W. Crane, Jr., Joshua G. Nickel, Zsolt Horvath | 2006-07-04 |
| 6905367 | Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same | Stanford W. Crane, Jr., Josh Nickel | 2005-06-14 |
| 6847115 | Packaged semiconductor device for radio frequency shielding | Stanford W. Crane, Jr., Vicente D. Alcaria | 2005-01-25 |
| 6803650 | Semiconductor die package having mesh power and ground planes | Stanford W. Crane, Jr., Charley T. Ogata, Ton-Yong Wang, Andreas Cangellaris, Jose Schutt-Aine | 2004-10-12 |
| 6797882 | Die package for connection to a substrate | Stanford W. Crane, Jr., Charley T. Ogata | 2004-09-28 |
| 6734546 | Micro grid array semiconductor die package | Stanford W. Crane, Jr., Vicente D. Alcaria | 2004-05-11 |
| 6700138 | Modular semiconductor die package and method of manufacturing thereof | Stanford W. Crane, Jr., Jennifer Colegrove, Zsolt Horvath, Joshua G. Nickel, Lei Yang | 2004-03-02 |
| 6603193 | Semiconductor package | Stanford W. Crane, Jr., Vicente D. Alcaria | 2003-08-05 |
| 6270366 | Adaptable high integrated electric interconnecting system | Geol Hun Cho, Young Pyo Hong, Seong-Joon Lee, Chang Ho Jung | 2001-08-07 |
| 6073703 | Pin rotating tool and method | Young Pyo Hong, Song Hoon Ahn | 2000-06-13 |