Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709891 | Open-cavity semiconductor die package | Sanford W. Crane, Jr., Lakshminarasimha Krishnapura | 2004-03-23 |
| 6475832 | Open-cavity semiconductor die package | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura | 2002-11-05 |
| 6421254 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Dan Fuoco, Bill Ahearn | 2002-07-16 |
| 6307258 | Open-cavity semiconductor die package | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura | 2001-10-23 |
| 6266246 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Dan Fuoco, Bill Ahearn | 2001-07-24 |
| 6016256 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Lakshminarasimha Krishnapura, Moises Behar, Dan Fuoco, Bill Ahearn | 2000-01-18 |