Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11358907 | Biological solids processing | Thomas M. Anderson, Charles M. Wanstrom | 2022-06-14 |
| 9656188 | Method and apparatus for separating solid impurities from a fluid | Russell L. Cook, Alejandro Mejia | 2017-05-23 |
| 8945401 | Method and apparatus for separating solid impurities from a fluid | Russell L. Cook, Alejandro Mejia | 2015-02-03 |
| 6857173 | Apparatus for and method of manufacturing a semiconductor die carrier | Stanford W. Crane, Jr., Daniel Larcomb | 2005-02-22 |
| 6709891 | Open-cavity semiconductor die package | Sanford W. Crane, Jr., Yun Li | 2004-03-23 |
| 6679733 | Electrical connector having electrically conductive shielding | Stanford W. Crane, Jr., Arindum Dutta, Kevin Link | 2004-01-20 |
| 6475832 | Open-cavity semiconductor die package | Stanford W. Crane, Jr., Yun Li | 2002-11-05 |
| 6461197 | Female contact pin including flexible contact portion | Stanford W. Crane, Jr., Arindum Dutta, Kevin Link | 2002-10-08 |
| 6421254 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn | 2002-07-16 |
| 6334794 | Electrical connector having staggered hold-down tabs | Stanford W. Crane, Jr., Arindum Dutta, Kevin Link | 2002-01-01 |
| 6305987 | Integrated connector and semiconductor die package | Stanford W. Crane, Jr., Arindum Dutta | 2001-10-23 |
| 6307258 | Open-cavity semiconductor die package | Stanford W. Crane, Jr., Yun Li | 2001-10-23 |
| 6266246 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn | 2001-07-24 |
| 6247972 | Electrical connector assembly with a female electrical connector having internal flexible contact arm | Stanford W. Crane, Jr., Arindum Dutta, Kevin Link | 2001-06-19 |
| 6141869 | Apparatus for and method of manufacturing a semiconductor die carrier | Stanford W. Crane, Jr., Daniel Larcomb | 2000-11-07 |
| 6078102 | Semiconductor die package for mounting in horizontal and upright configurations | Stanford W. Crane, Jr. | 2000-06-20 |
| 6050850 | Electrical connector having staggered hold-down tabs | Stanford W. Crane, Jr., Arindum Dutta, Kevin Link | 2000-04-18 |
| 6031720 | Cooling system for semiconductor die carrier | Stanford W. Crane, Jr., Moises Behar, Arindum Dutta, Kevin Link, Bill Ahearn | 2000-02-29 |
| 6016256 | Multi-chip module having interconnect dies | Stanford W. Crane, Jr., Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn | 2000-01-18 |
| 5951665 | Interface optimized computer system architecture | Stanford W. Crane, Jr., Daniel P. Fuoco, Roy K. Lee, Kevin Link, Moises Behar +2 more | 1999-09-14 |