Issued Patents All Time
Showing 26–50 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6339191 | Prefabricated semiconductor chip carrier | Maria M. Portuondo | 2002-01-15 |
| 6334794 | Electrical connector having staggered hold-down tabs | Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link | 2002-01-01 |
| 6305987 | Integrated connector and semiconductor die package | Lakshminarasimha Krishnapura, Arindum Dutta | 2001-10-23 |
| 6307258 | Open-cavity semiconductor die package | Lakshminarasimha Krishnapura, Yun Li | 2001-10-23 |
| D447143 | Computer cabinet | Moises Behar, Kevin Link, Daniel J. Michalski | 2001-08-28 |
| 6266246 | Multi-chip module having interconnect dies | Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn | 2001-07-24 |
| 6247972 | Electrical connector assembly with a female electrical connector having internal flexible contact arm | Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link | 2001-06-19 |
| 6203347 | High-density electrical interconnect system | — | 2001-03-20 |
| 6141869 | Apparatus for and method of manufacturing a semiconductor die carrier | Daniel Larcomb, Lakshminarasimha Krishnapura | 2000-11-07 |
| D430565 | Computer cabinet | Kevin Link, Daniel J. Michalski, Moises Behar | 2000-09-05 |
| 6097086 | Semiconductor chip carrier including an interconnect component interface | Maria M. Portuondo | 2000-08-01 |
| 6092139 | Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board | Bruce A. Smith, Edward Robert Vanderslice | 2000-07-18 |
| 6078102 | Semiconductor die package for mounting in horizontal and upright configurations | Lakshminarasimha Krishnapura | 2000-06-20 |
| 6073229 | Computer system having a modular architecture | Maria M. Portuondo, Willard Erickson, Maurice Bizzarri | 2000-06-06 |
| 6050850 | Electrical connector having staggered hold-down tabs | Lakshminarasimha Krishnapura, Arindum Dutta, Kevin Link | 2000-04-18 |
| 6031720 | Cooling system for semiconductor die carrier | Lakshminarasimha Krishnapura, Moises Behar, Arindum Dutta, Kevin Link, Bill Ahearn | 2000-02-29 |
| 6016256 | Multi-chip module having interconnect dies | Lakshminarasimha Krishnapura, Yun Li, Moises Behar, Dan Fuoco, Bill Ahearn | 2000-01-18 |
| 5967850 | High-density electrical interconnect system | — | 1999-10-19 |
| 5951320 | Electrical interconnect system with wire receiving portion | — | 1999-09-14 |
| 5951665 | Interface optimized computer system architecture | Lakshminarasimha Krishnapura, Daniel P. Fuoco, Roy K. Lee, Kevin Link, Moises Behar +2 more | 1999-09-14 |
| 5941617 | Decorative panel for computer enclosure | Daniel J. Michalski, Moises Behar | 1999-08-24 |
| 5892280 | Semiconductor chip carrier affording a high-density external interface | Maria M. Portuondo | 1999-04-06 |
| 5819403 | Method of manufacturing a semiconductor chip carrier | Maria M. Portuondo | 1998-10-13 |
| 5822551 | Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board | Maria M. Portuondo, Willard Erickson, Maurice Bizzarri | 1998-10-13 |
| 5812797 | Computer having a high density connector system | Maria M. Portuondo, Willard Erickson, Maurice Bizzarri | 1998-09-22 |