Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11038417 | Series-parallel charge pump with NMOS devices | Joseph H. Colles, Steven E. Rosenbaum | 2021-06-15 |
| 11005455 | Generating voltage pulse with controllable width | Joseph H. Colles, Steven E. Rosenbaum | 2021-05-11 |
| 10855270 | Adaptive control of non-overlapping drive signals | Joseph H. Colles, Steven E. Rosenbaum | 2020-12-01 |
| 10763746 | Series-parallel charge pump with NMOS devices | Joseph H. Colles, Steven E. Rosenbaum | 2020-09-01 |
| 10546804 | Connection arrangements for integrated lateral diffusion field effect transistors having a backside contact | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2020-01-28 |
| 10490489 | Conductive clip connection arrangements for semiconductor packages | Laxminarayan Sharma | 2019-11-26 |
| 10446687 | Integrated circuit connection arrangement for minimizing crosstalk | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2019-10-15 |
| 10431598 | Vertical semiconductor device with thinned substrate | Michael A. Stuber | 2019-10-01 |
| 10424666 | Leadframe and integrated circuit connection arrangement | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2019-09-24 |
| 10290702 | Power device on bulk substrate | Michael A. Stuber, Jacek Korec, Boyi Yang | 2019-05-14 |
| 10249759 | Connection arrangements for integrated lateral diffusion field effect transistors | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2019-04-02 |
| 10217822 | Semiconductor-on-insulator with back side heat dissipation | Paul A. Nygaard, Michael A. Stuber, Max Samuel Aubain | 2019-02-26 |
| 10192989 | Integrated circuit connection arrangement for minimizing crosstalk | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2019-01-29 |
| 10135339 | High-speed open-loop switch-mode boost converter | Steven E. Rosenbaum | 2018-11-20 |
| 10128170 | Conductive clip connection arrangements for semiconductor packages | Laxminarayan Sharma | 2018-11-13 |
| 10083897 | Connection arrangements for integrated lateral diffusion field effect transistors having a backside contact | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2018-09-25 |
| 10079230 | Double-sided vertical semiconductor device with thinned substrate | Michael A. Stuber | 2018-09-18 |
| 9923059 | Connection arrangements for integrated lateral diffusion field effect transistors | Shanghui Larry Tu, Michael A. Stuber, Befruz Tasbas, Raymond Jiang | 2018-03-20 |
| 9754860 | Redistribution layer contacting first wafer through second wafer | Michael A. Stuber, Mark Drucker | 2017-09-05 |
| 9748272 | Semiconductor-on-insulator with back side strain inducing material | Paul A. Nygaard, Michael A. Stuber | 2017-08-29 |
| 9673219 | Vertical semiconductor device with thinned substrate | Michael A. Stuber | 2017-06-06 |
| 9576937 | Back-to-back stacked integrated circuit assembly | Michael A. Stuber | 2017-02-21 |
| 9570558 | Trap rich layer for semiconductor devices | Christopher N. Brindle, Michael A. Stuber | 2017-02-14 |
| 9530796 | Semiconductor-on-insulator integrated circuit with interconnect below the insulator | Michael A. Stuber, Chris Brindle | 2016-12-27 |
| 9515139 | Trap rich layer formation techniques for semiconductor devices | Anton Arriagada, Michael A. Stuber | 2016-12-06 |